Pin frame encapsulation has long been the industry standard

Pin frame encapsulation is suitable for almost every application:

  • Bilateral encapsulation, commonly used in memory, analog IC and microcontroller, etc消费品及汽车In the product。Such packages offer a wide variety of packaging capabilities, especially for manufacturing chips with low pin counts at a competitive cost。
  • Four side encapsulation, widely used in ASics, digital signal processors (DSP), microcontrollers and memory ics, it contains a variety of open and closed tools to provide low-cost and reliable solutions for medium and low pin count ics。
  • MicroLeadFrame® QFN packages, is based on copper frame as the substrate of the plastic close to chip size packaging (CSP) technology, can provide first-class thermal and electrical performance。These packages are ideal for any application where size, weight and performance are important factors。

ePad LQFP TQFP

A pin frame package that meets the needs of advanced applications

ePad TSSOP MSOP SOIC SSOP

Low cost, thermal performance optimized pin frame solution

LQFP

Perfect package to meet high density requirements

MicroLeadFrame®

Suitable size, weight and performance for portable applications

MQFP

Tailored to overcome state-of-the-art equipment challenges

PLCC

Pin frame solutions for consumer goods to automotive applications

PSOP

Suitable for packaging of higher power equipment

SOIC

Ideal package for reducing size and weight

SOT23 TSOT

When saving space is important for equipment that needs to be sealed

SSOP

Reliable packaging for performance optimized applications

TQFP

A pin frame solution capable of meeting compact size requirements

TSOP

Plastic pin frame package for memory applications

TSSOP MSOP

Large capacity, high value-added packaging solutions

Technical information required?

The data table

A brochure

The white paper

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