Thermal efficiency to meet high performance requirements

鼎博体育's ExposedPad LQFP/TQFP power IC package family provides a significant upgrade to the power-limited standard LQFPTQFP Thermal efficiency of packaging。Compared to the standard LQFP/TQFP package, this package can increase the heat dissipation efficiency up to 110%, extending the operating parameters。In addition, the ExposedPad can also be connected to the ground, thus reducing wire arc inductance, suitable for high frequency applications。The ExposedPad should be soldered directly to the PCB to create thermal and electrical advantages。For MCP solutions, 鼎博体育 also offers wafer stacking processes 3 d packaging

The ExposedPad LQFP/TQFP package provides designers with the necessary space to design and manufacture high-performance products as the ultimate application density of IC packages increases and product size decreases。A variety of applications including automotive (engine control components, powertrain and infotainment controllers), LCD/ flat screen televisions and telecommunications can benefit from such packages。High speed silicon technology is particularly suitable for the ExposedPad LQFP/TQFP package due to its excellent grounding performance。

特色

  • 5 x 5 mm to 28 x 28 mm package sizes
  • 32-256 pin numbers
  • Large number of grain plate size options
  • Double underset grounding impedance ring pad
  • 1 for TQFP.0 mm package thickness
  • 1 for LQFP.4 mm package thickness
  • Custom pin frame design
  • The ExposedPad can be easily reversed to fit the heat sink bonding
  • 薄型 – <1.2 mm maximum mounting height
  • Electrical - The use of pads as ground lines significantly reduces wire arc inductance and increases the number of signal pins available, thus increasing the operating frequency up to 2.Four gigahertz

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