The same benefits as TQFP, in a smaller package

鼎博体育 has a wide range of LQFP (low Profile Quadrangle flat package) IC packages that have been specially designed to be capable of being packaged in 1.4 mm package thickness provides the same benefits as TQFP。This type of packaging enables IC package engineers, component spec setters and system designers to solve problems ranging from increased motherboard density to reduced chip pitch and thinning of the final product。


  • 7 x 7 mm to 28 x 28 mm package sizes
  • 1.4 mm package thickness
  • 32-256 pin numbers
  • Preplated frame option
  • Inverted backing plate configuration
  • Copper, gold and silver wire are available
  • Offers a wide range of wafer pad sizes and custom lead frame designs
  • Optimized for stacked wafers
  • Lead-free and RoHS compliant materials

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