Optimize IC package performance

SOIC (Small Form IC Package) is a lead-based plastic package for applications that need to optimize the performance of IC packages。These industry-standard packages are mass-produced to provide high value-added, low-cost solutions for a wide range of applications。

特色

  • Copper wire interconnects to reduce costs
  • Standard JEDEC package shape
  • Multi-grain manufacturing capability
  • "One-stop" work styleTesting services, including strip test options
  • Standard green material - Lead free and RoHS compliant
  • Invisible cutting (narrower cutting channel)
  • Larger/higher density lead frame strips
  • Lead frame roughened to optimize MSL functionality

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