Value-added, low-cost packaging solutions

SSOP and QSOP are lead frame-based plastic packages for applications that need to optimize IC package performance, compress package size, and reduce pin pitch。Such industry-standard IC packages support high volume manufacturing while significantly reducing size and providing high value-added, low-cost solutions for a wide range of applications。

特色

  • Lowest cost copper wire互连
  • Standard JEDEC package shape
  • Multi-grain manufacturing capability
  • "One-stop" work styleTesting services, including strip test options
  • Standard green material - Lead free and RoHS compliant
  • Invisible cutting (narrower cutting channel)
  • Larger/higher density lead frame strips
  • Lead frame roughened to optimize MSL functionality

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