Provides design flexibility for medium voltage power applications

HSON8 package has the same area as standard SOP8 package (5 x 6 mm)。HSON8 uses exposed pads to optimize thermal performance。HSON8 is suitable for medium power applications (reference value 80W*/60A) and is tailored for low on-resistance and high speed switching MOSFEts。


  • Aluminium wire welding
  • The lead end plating thickness exceeds 50% of the lead frame thickness
  • From wafer cutting to finished product testing and packaging one-stop service
  • Green materials: lead free plating and halogen free molding compounds

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