Thin, thermal performance optimized power discrete packages for smaller designs

鼎博体育's PSMC Power discrete device package is part of our FLAT compact surface mount package family that is thinner, optimizes thermal performance and supports miniaturization。Psmc-encapsulated copper interconnects can reduce electrical resistance and improve thermal performance compared to welded wire products。

The package offers two and three pin options for high efficiency diodes and transistors such as Schottky barrier diodes (SBD), rectifiers and Zener diodes, transient voltage suppressors (TVS) and MOSFET。New technologies developed include larger/higher density pin frame strips and environmentally friendly lead-free solder pastes。The package is also known as TO277-A, SMPC or CFP15。


  • Copper connector construction to reduce inductance and resistance
  • Optimized thermal performance
  • From wafer probe to testing and packaging one-stop service
  • Green materials: lead free plating and halogen free molding compounds

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