Power discrete packaging for medium voltage power supply applications

The DPAK (TO-252) package is JEDEC compliant and tailored for surface mount applications。The DPAK package is designed for medium-voltage power applications and is optimized for low on-resistance and high-speed switching MOSFEts such as motor drives, power circuits, DC-DC converters, consumer products and automotive products。


  • Thick aluminum wire is used to achieve low on-resistance and high current density
  • From wafer cutting to finished product testing and packaging one-stop service
  • Green materials: lead free plating and halogen free molding compounds

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