鼎博体育 experts within the world class design center can collaborate with customers to design the highest quality packages to meet product requirements。

鼎博体育's design engineers are trained experts with extensive experience in the latest design tools and packaging technologies。Each year, we handle thousands of new packaging designs for existing and next-generation products。Our world-class design centers are strategically located in the United States, South Korea, China, Portugal and Taiwan to reduce design cycle times and provide expert advice to clients。

鼎博体育 considers cost design (DFC) and manufacturing Design (DFM) in performance Design (DFP)。Our design staff are rigorously trained and have a wealth of tests to provideLead frameThe laminateWafer levelDesign services。

Chip package circuit board co-design/co-validation

鼎博体育 has the experience and expertise to co-design and co-validate our chip-packaged circuit boards to verify that our customers' designs meet stringent system-level requirements。

Package Assembly Design Kit (PADK)

In order to ensure that the client's design requirements are met during the design phase, 鼎博体育 has established a program for SWIFT® Product development Package assembly design suite, lead to fill the gap between chip design and package design。

Cost Design (DFC)

鼎博体育 conducts cost analysis of all designs for the 鼎博体育 Design Center。Cost analysis and optimization are performed before, during and after design。This repetitive process evaluates cost-performance requirements and trade-offs between substrates and packaging。

Online Design rules

鼎博体育's expert design engineers are well versed in all of 鼎博体育's design rules, which are also available to customers。After registration, customers can register at 鼎博体育 Web.Data PortalTo access and download such design rules。

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