The success of customer package design depends on the accuracy of modeling and measurement

Whether our customers' silicon wafers are RF, mixed-signal or high-speed digital designs, 鼎博体育 has the tools and experience to optimize package design and bring out the full range of its characteristics。

Mechanical packaging characteristics

Mechanical characteristics are inseparable from 鼎博体育's product development and characteristics。From product definition and performance prediction, to validation and reliability testing, 鼎博体育 helps measure all mechanical properties associated with customer devices。

Thermal packaging characteristics

鼎博体育 provides advanced thermal measurement and cutting-edge modeling services that support all major electronic package forms and system-level characteristics。We maintain a database of JEDEC standard test boards and can provide custom board designs。In addition, we offer custom thermal solutions to optimize component-level design。

Electronic packaging

The success of today's high-speed digital and RF circuit designs is highly dependent on modeling and measurement accuracy, including package characteristics。鼎博体育's approach consists of a combination of electrical models based on 2D, 3D, and full-band 3D package simulations and time and frequency domain measurements。

RF characteristics and testing

5G feature analysis and testing

鼎博体育 provides advanced RF product characteristics analysis and testing services:

  • Development support from design through production to automated product testing
  • Design optimization
  • The electric simulation
  • Electrical benchmarking and characteristics
  • Test automation

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