鼎博体育 is the first OSAT to adopt AiP/AoP technology for high volume production (HVM)

鼎博体育's cutting-edge AiP and AoP technologies have been deployed to provide full integration for smartphones and other mobile devices 5G NR Millimeter Wave (mmWave) and Sub-6 GHz RF modules。This type of MILLIMETER wave antenna module provides many functions in a very compact size across multiple spectral bands, making it suitable for integration into mobile devices。

Until now, millimeter-wave signals have never been used in mobile wireless communications due to a number of technical and implementation challenges that affect virtually every aspect of equipment engineering, including materials, appearance specifications, industrial design, thermal performance, and regulatory requirements for radiated power。Successful implementation of such antenna solutions in 5G millimeter wave and sub-6 spectrum bands will revolutionize the mobile industry and consumer experience。

Why AiP/AoP?What are the benefits for smart phones?

AiP/AoP can improve 5G signal integrity and overcome the following challenges: using a small volume phase antenna array design and minimizing space requirements in order to support millimeter waves within 5G equipment。

Technical challenges that AiP/AOP can overcome

  • 传输:The path loss and attenuation of high frequency MMW are higher, so the signal is difficult to transmit very far
  • 范围:Millimeter wave signals are easily blocked by objects
  • 尺寸:Millimeter-wave usually requires an array of antenna elements to help solve such problems, thus increasing its volume within the device

Key 鼎博体育 packaging technologies for AiP/AoP

  • More than 26 GHz.
  • Blocks shielding
  • Partial (selective) conformal shielding
  • Part of the molding
  • Package size: Max. 23.0 mm x 6.0 mm
  • Number of substrate layers: up to 14 layers
  • Suitable for 77 GHz and above thin film RDL and dielectric

5G market challenges:

Market requirements:

  • Introduce millimeter wave frequency
  • The demand for power consumption is higher
  • Number of RF components increased
  • Millimeter wave测试

鼎博体育 offer:

  • Advanced multichip integration toolbox
  • RF SiP Design and simulation techniques
  • The complete fcCSPWLCSP WLFO Product portfolio
  • Mature and reliable supply chain
  • Global assembly scale and testing investment

In addition to its various system-level package (SiP) capabilities and AiP/AoP technologies,鼎博体育 has also developed a powerful tool portfolio,In order to maximize the circuit density,And solve the complex packaging format problem required by 5G application productization,例如,Double packaging,Chip embedded substrate,Thin film RDL and dielectric,And various types of RF shielding。This portfolio combines 鼎博体育's expertise in RF and antenna packaging design, making 鼎博体育 uniquely positioned to better serve customers who need to outsource the challenges and high investment associated with the integration of advanced multi-chip packaging and testing technologies for 5G networks。

With the demand for 5G-enabled packages growing rapidly, 鼎博体育 has embarked on and successfully implemented AiP/AoP technology。

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