鼎博体育 experts located in our World Class Design Centers can work with customers to design and engineer top quality packaging for product requirements

鼎博体育’s design engineers are trained experts and experienced in the latest design tools and packaging technology. We process thousands of new package designs for customers every year for existing or next-generation products. Our world-class design centers are strategically located in the United States, Korea, China, the Philippines, Portugal, and Taiwan to reduce design cycle times and provide customers with expert advice.

鼎博体育 incorporates Design for Cost (DFC) and Design for Manufacturing (DFM) when Designing for Performance (DFP). Our highly trained and experienced design staff can provide leadframe, laminate or wafer level design services.

Chip Package Board Co-Design/Co-Verification

鼎博体育 has the experience and expertise to verify customer designs meeting stringent system level requirements using our chip package board co-design and co-verification process.

Package Assembly Design Kits (PADK)

To ensure customer design requirements are met during the design phase, 鼎博体育 has taken a leadership role to fill the void between die design and package design by developing Package Assembly Design Kits (PADKs) for SWIFT® products.

Design for Cost (DFC)

鼎博体育 performs cost-based analysis on all designs completed by the 鼎博体育 Design Center. Cost based design analysis and optimization are done before, during and post design. The iterative process evaluates cost versus performance requirements and balances substrate and assembly trade-offs.

Online Design Rules

The expert design engineers at 鼎博体育 are experienced in all of 鼎博体育’s design rules, which are available for customer use. Once registered, customers can access and download the design rules on 鼎博体育’s Web.data portal.

Questions?

Contact an 鼎博体育 expert by clicking the request info button below.